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The army sputterer is a load-locked UHV chamber that can be used to sputter Nb, Mo, Ti, or Al. Up to 3 materials can be co-spuuterer. Super-user – Brian Straughn(straughn@umd.edu, x56131) Supervisors – Prof Chris Lobb, lobb@squid.umd.edu, 56130 and Prof Fred Wellstood, well@squid.umd.edu, x57649 Edwards Evaporator –Room 0219
Supervisor: Prof Chris Lobb, lobb@squid.umd.edu, 56130 SiO2 Sputter chamber – Room 0219 A dedicated diffusion-pumped UHV chamber for rf sputterring thin films of SiO2. Includes a crystal monitor for measuring thickness of deposited films Super-user: Brian Straughn( straughn@umd.edu, x56131) Trilayer Sputter Chamber – Room 4303
This UHV sputter system can be used to co-sputter up to 3 materials and deposit a fourth material from its electron gun. It also has a 3cm ion gun for in situ cleaning and etching deposited films. The main chamber usually stays at < 1 x 10E-7 and a load lock and transfer arm are used to minimize contamination. Super-user: Brian Straughn( straughn@umd.edu, x56131) Tunnel Junction Evaporator – Room 0219
Used to make thin films of Ag, Au, Nb, and Al. NO ferromagnetic materials are allowed in this chamber. Super-user: Brian Straughn( straughn@umd.edu, x56131)
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