Search the Center's Web Site:


 

CNAMbar
ThinFilm

Army Sputterer – Room 4303

Armysputter]

The army sputterer is a load-locked UHV chamber that can be used to sputter Nb, Mo, Ti, or Al. Up to 3 materials can be co-spuuterer.

Super-user – Brian Straughn(straughn@umd.edu, x56131)

Supervisors – Prof Chris Lobb, lobb@squid.umd.edu, 56130 and Prof Fred Wellstood, well@squid.umd.edu, x57649

Edwards Evaporator –Room 0219

Edwards

 

Supervisor: Prof Chris Lobb, lobb@squid.umd.edu, 56130
Super-user: Brian Straughn( straughn@umd.edu, x56131

The Edwards 306A is a high vacuum thermal evaporator that is used to deposit thin films of various solids. Deposition of thin metal films such as Ag, Au, and Cr is the primary use of the 306A and in this capacity it is an ideal tool for quickly making contact layers on patterned electronic devices. Source materials are evaporated from one of four electrodes that are attached to a rotary stage allowing multiple depositions without venting the chamber. The liquid nitrogen trapped diffusion pump reaches its base pressure of 1x10-6 in about 1 hour. Though a variety of materials can be deposited, permission is required to do toxic, high vapor pressure, or ferromagnetic materials. Contact Brian Straughn  @ x56131 or straughn@umd.edu for authorization to use the Edwards 306A

SiO2 Sputter chamber – Room 0219

A dedicated diffusion-pumped UHV chamber for rf sputterring thin films of SiO2. Includes a crystal monitor for measuring thickness of deposited films

Super-user: Brian Straughn( straughn@umd.edu, x56131)
Supervisor: Prof Chris Lobb, lobb@squid.umd.edu, 56130

Trilayer Sputter Chamber – Room 4303

Trilayer

This UHV sputter system can be used to co-sputter up to 3 materials and deposit a fourth material from its electron gun. It also has a 3cm ion gun for in situ cleaning and etching deposited films. The main chamber usually stays at < 1 x 10E-7 and a load lock and transfer arm are used to minimize contamination.

Super-user: Brian Straughn( straughn@umd.edu, x56131)
Supervisor: Prof Steve Anlage, anlage@squid.umd.edu, x57321

Tunnel Junction Evaporator – Room 0219

TunnelJunction

Used to make thin films of Ag, Au, Nb, and Al. NO ferromagnetic materials are allowed in this chamber.
Other features include a 3cm ion gun, 3 sputter guns, 4 thermal sources, thickness monitor, and cryo-pumped vacuum chamber.

Super-user: Brian Straughn( straughn@umd.edu, x56131)
Supervisor: Prof Fred Wellstood, well@squid.umd.edu, x57649


Center for Nanophysics and Advanced Materials
University of Maryland
College Park, MD 20742-4111
Phone: 301.405.6129 Fax: 301.405.3779
Copyright © 2001 University of Maryland
Contact us with comments, questions and feedback