FACILITIES -- Thin Film Deposition, Rooms 4303, 0219,

Army Sputterer, Room 4303

sputter

 

The army sputterer is a load-locked UHV chamber that can be used to sputter Nb, Mo, Ti, or Al. Up to three materials can be co-sputtered.

Super-user: Brian Straughn, straughn@umd.edu, x56131)

Supervisors: Prof. Chris Lobb, lobb@squid.umd.edu, x56130 and Prof. Fred Wellstood, well@squid.umd.edu, x57649

Edwards Evaporator, Room 0219

evaporator

 

The Edwards 306A is a high vacuum thermal evaporator that is used to deposit thin films of various solids. Deposition of thin metal films such as Ag, Au, and Cr is the primary use of the 306A and in this capacity it is an ideal tool for quickly making contact layers on patterned electronic devices. Source materials are evaporated from one of four electrodes that are attached to a rotary stage allowing multiple depositions without venting the chamber. The liquid nitrogen trapped diffusion pump reaches its base pressure of 1x10-6 in about 1 hour. Though a variety of materials can be deposited, permission is required to do toxic, high vapor pressure, or ferromagnetic materials. Contact Brian Straughn at x56131 or straughn@umd.edu for authorization to use the Edwards 306A.

Super-user: Brian Straughn, straughn@umd.edu, x56131

Supervisor: Prof. Chris Lobb, lobb@squid.umd.edu, 56130
  

SiO2 Sputter Chamber, Room 0219

sputter chamber

 

A dedicated diffusion-pumped UHV chamber for rf sputterring thin films of SiO2. Includes a crystal monitor for measuring thickness of deposited films

Super-user: Brian Straughn( straughn@umd.edu, x56131)

Supervisor: Prof. Chris Lobb, lobb@squid.umd.edu, 56130

Trilayer Sputter Chamber - Room 4303

trilayersputter

 

This UHV sputter system can be used to co-sputter up to 3 materials and deposit a fourth material from its electron gun. It also has a 3cm ion gun for in situ cleaning and etching deposited films. The main chamber usually stays at < 1 x 10-7 and a load lock and transfer arm are used to minimize contamination.

Super-user: Brian Straughn, straughn@umd.edu, x56131
  
Supervisor: Prof. Steve Anlage, anlage@squid.umd.edu, x57321

Tunnel Junction Evaporator, Room 0219

tunnel

 

Used to make thin films of Ag, Au, Nb, and Al. NO ferromagnetic materials are allowed in this chamber.
Other features include a 3cm ion gun, 3 sputter guns, 4 thermal sources, thickness monitor, and cryo-pumped vacuum chamber.

Super-user: Brian Straughn, straughn@umd.edu, x56131
  
Supervisor: Prof. Fred Wellstood, well@squid.umd.edu, x57649

 

 

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